• 专利附录
  • 专利说明
  • 权利要求
  • 类似技术
  • 同族专利
  • 引用文献
  • 法律状态
  • 优先权
    • 专利摘要:
    A printed circuit board structure (7) having at least one dielectric insulating layer (2, 5o, 5u) and at least one conductor layer (3, 4, 6o, 6u), in which within the at least one insulating layer (5a) a layer (5) of a dielectric heat conducting Material is provided, which is at least in the vicinity or in contact with an inner conductor arrangement (3). In this case, in the immediate vicinity or in contact with the layer (5) made of a dielectric heat-conducting material, a further heat-conducting layer (11), preferably an electrically conductive metal layer may be provided. Also, an at least heat-conducting, preferably electrically conductive plated-through hole (9) can be guided from a conductor section (6om) on the printed circuit board into the inner side of the printed circuit board, at least in the vicinity of the layer (5) of a dielectric heat-conducting material.
    公开号:AT515069A1
    申请号:T50163/2014
    申请日:2014-03-05
    公开日:2015-05-15
    发明作者:
    申请人:Austria Tech & System Tech；
    IPC主号:
    专利说明:

    Printed circuit board structure
    The invention relates to a printed circuit board structure having at least one dielectric insulating layer and at least one conductor layer.
    The distribution of heat generated and the cooling of components in a printed circuit board, in short, that thermal management, is becoming a more and more prominent problem. Due to the fact that the surfaces of a printed circuit board must accommodate an increasing number of components, in particular ICs, and these components are increasingly developing heat due to, for example, high functional integration within the chips, the functionality of the components, e.g. As the ICs, to avoid problems with the customer, for example, the problem of very hot mobile phones on one ear of the user is called. It is known that generated heat, where possible, is transported to so called heat sinks via so-called thermal vias, i. s. Elements that are located on the Ober¬fläche the circuit board and then active or passive, z. B. can be cooled by means of a Ventila¬tors.
    However, the production of such thermal vias is costly and time consuming, and often such thermal vias can not be created in the immediate vicinity of the heat source, reducing their effectiveness.
    It is therefore an object of the invention to provide a printed circuit board structure which offers better thermal management and which is cheaper to manufacture.
    This object is achieved by a printed circuit board structure in which, within the at least one insulating layer according to the invention, a layer of a dielectric heat-conducting material is provided, which is at least in proximity or in contact with an inner conductor track structure.
    Thanks to the invention, there is a favorable production of printed circuit boards, in which the heat is to be dissipated or distributed from strongly heated areas, and moreover the appearance of the printed circuit board is not changed, i. H. the dimensions and in particular the thickness can remain the same. In addition, the circuit board structure can be produced by conventional circuit board manufacturing methods. The invention offers its particular advantages in mobile devices such as mobile telephones, mobile computers, in the automotive industry as well as in medical and other industrial products.
    For even better distribution and dissipation of accumulating heat can be provided that in the immediate vicinity or in contact with the layer of a dielectric heat-conducting material, a further heat-conducting layer is provided. In most cases of application, the further heat-conducting layer is preferably an electrically conductive metal layer.
    For the efficient and rapid dissipation of heat into the interior of the structure, it can advantageously be provided that an at least thermally conductive via is guided from a conductor section located on the printed circuit board inside the printed circuit board interior to the vicinity of the layer of a dielectric heat-conducting material. It is particularly useful in this case, when the thermally conductive via is electrically conductive, is guided to an inner conductor and is in electrical contact with this.
    A further improvement of the heat management can be achieved if a Durchkon¬taktierung is performed by a conductor section to a distance from this Leiterab¬ section, said via also extends at least in the vicinity of the layer of a dielectric heat-conducting material. It may also be advantageous if the via is in communication with an inner conductor track structure. In many cases, it is also recommended that the via be routed from an outer conductor layer on one side to an outer conductor layer on the opposite side.
    A particularly good heat transfer is obtained when the layer of a dielectric heat-conducting material fills interspaces of the inner conductor track structure.
    The invention together with further advantages is explained in more detail below with reference to the appended drawings by way of example embodiments. In these show:
    1 to 4 show in schematic partial sections the production and the construction of a first embodiment of the invention,
    5 to 10 show in schematic partial sections the manufacture and construction of a second embodiment of the invention,
    11 to 15 show in schematic partial sections the production and the construction of a third embodiment of the invention,
    16 to 23 show in schematic partial sections the manufacture and construction of a fourth embodiment of the invention,
    24 to 26 show in schematic partial sections the manufacture and construction of a fifth embodiment of the invention and
    Fig. 27 as a sixth embodiment of the invention in a section a variant of the embodiment shown in Figure 26.
    First, with reference to Figs. 1 to 4, the preparation of a first Ausfüh¬ form of the invention will be described. Here, the starting point is a printed circuit board 1 shown in FIG. 1, which consists of an insulating layer 2, eg a prepreg, and an upper conductor track structure 3 with printed conductors 3a to 3d and a lower printed conductor structure 4 with printed conductors 4a and 4b drawn here. The printed circuit board 1 is generally prefabricated and then already has an etched copper image. In a next step according to FIG. 2, a layer 5 made of a thermally conductive dielectric material is then applied to the upper interconnect structure, wherein intermediate spaces between individual interconnects are likewise filled with this thermally conductive dielectric material 5. For such a thermally conductive material, for example, ceramic-filled pastes, carbon nanotubes come into question, wherein the application process can be different.
    A preferred method are printing methods, e.g. As screen printing, stencil printing or other printing methods, but other methods for applying the wärmeleitfähi¬gen material can be used. The thermally conductive material can also be applied over the entire surface by another process, with subsequent structuring being advantageous if the material is not desired over the entire surface or if it is not possible with conventional printing processes to print a potentially technically complex design. One can then apply the thermally conductive material over the entire surface using a conventional printing process and pre-curing (corresponding to the so-called "B staging" of epoxy resins, such as FR 4). Then, structuring can be carried out with a photolithographic process customary in printed circuit board production, wherein e.g. The exposure is carried out with a film masking or by LDI (Laser Direct Imaging). As a result, after washing away with suitable chemicals, the structure is obtained and the material is completely cured. Hardening is carried out by means of conventional curing methods, e.g. thermal curing, UV or IR curing, application of laser radiation, etc.
    The layer thicknesses of the thermally conductive materials are in particular in the range of 5pm to 100 μιη and the thermal conductivities depending on the material are between 1 W / mK and 20 W / mK.
    In a next step according to FIG. 3, the existing structure according to FIG. 2 is supplemented by further layers of prepregs and copper foils, namely by an upper layer 5o of a dielectric and a lower layer 5u of a dielectric, these layers 5o and 5u being protected by a copper layer 6o or 6o 6u be covered, z. By copper foils. It should be noted that the terms " top " and " bottom " refer only to the illustrations in the drawings and are used for ease of description.
    In a final step, the upper conductor layer 6o and the lower conductor layer 6 are structured as desired, so that individual printed conductors 5a, 6ob and 6ua, 6ub and 6uc result in the drawing. The layer 5 of thermally conductive material ermög¬ lichst it now, heat in the present case, for. B. caused by heating of the conductor tracks 3b or 3c, dissipate and distribute from these interconnects, so that neither in the interior, nor on the surface of the thus-obtained printed circuit board structure 7 excessive heat - so-called "hot spots". - arises.
    A variant of the invention will now be explained with reference to FIGS. 5 to 10, wherein the same reference numerals are used for vergleichbaren parts and Figs. 5 to 7 correspond to Figs. 1 to 3, since up to this point the manufacturing process the same as before is described. Starting from the construction according to FIG. 7, a laser bore 8 is now produced from the top to the conductor track 3b, the methods used in printed circuit board manufacturing being known. Typically, the top copper layer 6o is first drilled with one of the usual laser drilling methods used in the circuit board industry, such as standard UV / CO2 lasers, Copper Direct CO2 lasers, etc. After completed drilling 8, a copper plating takes place, for example by means of a galvanic process, whereby a via 9 (vertical interconnect access, through-connection) is generated from the upper copper track 60 to the copper track 3 (see FIG. 9). Subsequently, with a copper plating process likewise customary in the circuit board industry, the copper thickness required for the subsequent structuring process is copper-plated. Instead of a vias made in this way, a mechanical through-connection from the top to the bottom can also be produced.
    Thereafter, the upper copper track can be patterned and the finished printed circuit board structure 10, according to FIG. 10, is obtained. In the embodiment illustrated here, heat can be generated, in particular, from the middle upper interconnect 60m in FIG. 10, which for example arises when this interconnect a chip with a pad is placed in the interior of the track, passing through the heat-conducting layer 5, which serves as the dielectric layer, i. H. is formed insulating, is distributed. This avoids excessive heating on the surface of the structure 10.
    A further variant of a printed circuit board structure according to the invention will now be described with reference to FIGS. 11 to 15, again using the same reference numerals for the same parts. Figs. 11 and 12 need no further explanation, as they correspond to Figs. 1 and 2. Starting from the structure now shown in FIG. 12, a further heat-conducting, in particular an electrically conductive, metallic layer 11 is now applied to the heat-conducting dielectric layer 5, for example by a printing method. In a next step, the result of which can be seen in Fig. 14, this metal layer 11 is clad by means of a layer 5 'of thermally conductive dielectric material. The metal layer 11 is thus embedded in a thermally conductive dielectric 5, 5 '. The layer 11 does not necessarily consist of a pure metal, it could also metal compounds, such. Aluminum nitride, or find metal ceramics Verwen dung.
    In a further step, the thermally conductive dielectric layers 5o and 5u, as well as conductor layers 60 and 6u, comparable to FIG. 3, are now applied and patterned, so that a finished printed circuit board structure 12 is obtained, as shown in FIG. As already mentioned, conventional methods known to those skilled in the art of printed circuit board manufacture can be used to make such structures, particularly the pressing of prepreg sheets, the material of which is selected according to the desired application, the electrodeposition of metal layers, and the application of metal layers by printing process. In the case of a galvanic application of the conductor layers 6o and 6u, these can then be patterned by means of a masking process. In variants of this embodiment, the method can also be carried out in the sense of a double-sided structure, in which also in the lower layer 5u a metal layer is embedded in a thermally conductive dielectric, or the second step of pressing the thermally conductive dielectric layer can be omitted.
    Yet another embodiment will now be explained with reference to FIGS. 16 to 23. The printed circuit board 1 in FIG. 16 in turn corresponds to the printed circuit board 1 according to FIG. 1 or FIG. 11 and the same applies to the structure according to FIG. 17, which corresponds, for example, to FIG. 12 corresponds. In a similar manner, as shown in FIG. 13, a metal layer 11 is applied in this embodiment, but here has a recess 11a. In a next step, comparable to FIG. 14, an additional layer 5 'of a dielectric heat-conducting material applied to the jacket of the metal layer 11, for. B. imprinted.
    The construction according to FIG. 19 is now supplemented by pressing with an upper and lower dielectric layer 5o, 5u and conductor layers 6o, 6u, the result being shown in FIG. Next, as shown in Fig. 21, a laser bore 8 (see also Fig. 8) is fabricated and, as shown in Fig. 22, a via 9 (see Fig. 9) is fabricated by an electroless and galvanic process. After structuring the upper and lower conductor layers 6o and 6u (in the present case, the lower conductor layer 6u was already structured), the printed circuit board structure 13 according to FIG. 23 is present, which is formed by the combination of the dielectric thermally conductive layers 5, 5 'with the Metal layer 11 and the Via 9 distinguished. Here, for example, heat generated in the conductor 3c can be managed, ie distributed appropriately, and also heat dissipated in the conductor 6om, for example by a chip seated on this conductor, can be dissipated into the interior of the structure 13. All that has been said in connection with the examples described above for the preparation and structuring of the various layers used applies equally to this and the following example. Also in this embodiment, the method can be carried out in the sense of a double-sided structure.
    With reference to FIGS. 24 to 26, an embodiment of the invention will now be explained. On a thin conductor layer 14, namely a copper foil, a layer 15 of thermally conductive dielectric material is printed, wherein the layer 15 struktu¬riert or applied over the entire surface and can be structured later, if necessary. Printing takes place on the so-called "treatment" side (inner side) of the copper foil. Hardening is accomplished by one of the known methods already mentioned.
    This structure, consisting of the layers 14 and 15, is now connected to a prefabricated and partially structured circuit board 16, for example by pressing in the manner shown in Fig. 25, wherein now the copper foil 14 with the layer 15 with respect to FIG. 24 is turned over. A structure according to Fig. 25 is obtained in which the printed circuit board 16 used in this case is a dielectric, for. B. a prepreg, with a lower Leiter¬ layer 17, and two internal, structured conductor layers 18 and 19 has.
    In a following step, the result of which is shown in FIG. 26, a bore 20 penetrating the entire structure is produced, for example mechanically or with the aid of a laser device. In addition, the conductor layers 14 and 17 are patterned. The steps of producing the drilling and structuring can also be interchanged. The bore 20 now connects a conductor track section of the upper conductor layer 14 and a conductor track section of the lower conductor layer 17 and is provided on the inside with a conductive copper layer 21 by a copper plating process. which conductor track sections of the conductor layers 14,18,17 electrically and thermally conductively connects. In this embodiment, heat, which is introduced for example at the upper end of the bore 20 in a portion of the conductor layer 14, in the interior of the thus obtained Lei¬terplattenstruktur 22nd be introduced and distributed.
    Finally, FIG. 27 shows a variant, starting from FIG. 26, in which additionally additional dielectric layers 23 and 24 as well as conductor layers 25 and 26 are applied to the structure according to FIG. Moreover, in this printed circuit board structure denoted by 27, a metal layer 11, such as in Fig. 23, is provided in the layer 15 of thermally conductive dielectric material, resulting in improved heat distribution. In the structure 27, heat may be generated either in the region of the bore 20 or, for example, on a conductor track of the structured conductor layer 14.
    It should finally be clear that the illustrations of FIGS. 1 to 27 generally only show details of a larger printed circuit board structure, and in practice different variants can be combined. For example, the variant according to FIG. 27 could also have a via 9 adjacent to a bore 20.
    权利要求:
    Claims (9)
    [1]
    Claims 1. Circuit board structure (7,10,12,13, 22, 27) with at least one dielectric insulating layer (2, 5o, 5u) and at least one conductor layer (3,4, 6o, 6u), characterized in that within the at least an insulating layer (5o, 5u) is provided a layer (5) made of a dielectric heat-conducting material, which is at least in the vicinity or in contact with an inner conductor track structure (3).
    [2]
    Second printed circuit board structure (7, 10, 12, 13, 22, 27) according to claim 1, characterized in that in the immediate vicinity or in contact with the layer (5) of a dielectric heat-conducting material, a further heat-conducting layer (11) is provided.
    [3]
    Third printed circuit board structure (7, 10, 12, 13, 22, 27) according to claim 2, characterized in that the further heat-conducting layer is an electrically conductive metal layer (11).
    [4]
    4. printed circuit board structure (7, 10, 12, 13, 22, 27) according to one of claims 1 to 3, characterized in that an at least thermally conductive via (9) from a circuit board outer conductor portion (6om) in the PCB interior at least in the vicinity the layer (5) is guided by a dielectric heat-conducting material.
    [5]
    Circuit board structure (7, 10, 12, 13, 22, 27) according to claim 4, characterized in that the thermally conductive via (9) is electrically conductive, is guided to an inner conductor track (3b) and is in electrical contact therewith.
    [6]
    6. printed circuit board structure (7, 10, 12, 13, 22, 27) according to one of claims 1 to 5, characterized in that a through-hole (21, 20) of a conductor portion (14) zueinem remote from this conductor portion (17) is guided, wherein this Durch¬kontaktierung extends at least in the vicinity of the layer (5) of a dielectric wärmelei¬tenden material.
    [7]
    7. printed circuit board structure (7, 10, 12, 13, 22, 27) according to claim 6, characterized in that the through-connection (21, 20) with an inner conductor track structure (18) is in Verbin¬ dung.
    [8]
    8. printed circuit board structure (7,10,12,13, 22, 27) according to claim 6 or 7, characterized gekennzeich¬net that the via (21, 20) from an outer conductor layer (14) on one side to an outer conductor layer (17 ) is guided on the opposite side.
    [9]
    Circuit board structure (7, 10, 12, 13, 22, 27) according to one of claims 1 to 8, characterized in that the layer (5) of a dielectric heat-conducting material fills spaces of the inner conductor track structure (3).
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    同族专利:
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    法律状态:
    优先权:
    申请号 | 申请日 | 专利标题
    AT8572013|2013-11-07|
    ATA50163/2014A|AT515069B1|2013-11-07|2014-03-05|Printed circuit board structure|ATA50163/2014A| AT515069B1|2013-11-07|2014-03-05|Printed circuit board structure|
    PCT/AT2014/050238| WO2015066742A1|2013-11-07|2014-10-09|Printed circuit board structure|
    EP14795937.3A| EP3066898B1|2013-11-07|2014-10-09|Printed circuit board|
    US15/034,829| US10225920B2|2013-11-07|2014-10-09|Printed circuit board structure|
    CN201480072307.0A| CN105900534B|2013-11-07|2014-10-09|Printed circuit board structure|
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